Bohong sharing --Diamond may become the ultimate semiconductor material
2023 01/30
The bandgap width of diamond is as high as 5.5eV, which is far higher than that of gallium nitride, silicon carbide and other materials. The carrier mobility is also three times that of silicon materials. The intrinsic carrier concentration is extremely low at room temperature, and it has excellent high temperature resistance properties . The application of diamond in the semiconductor field is becoming more and more extensive. Countries around the world are stepping up the research and development of diamond in the semiconductor field. Among them, Japan has successfully developed an ultra-high-purity 2-inch diamond wafer mass production method, and its storage capacity is equivalent to 1 billion Blu-rays. Optical disc (approximately 25 million TB). The annual output of natural diamonds in the world is about 150 million carats, while the output of synthetic diamonds exceeds 20 billion carats, 95% of which come from mainland China.
